Tin-coated copper photovoltaic ribbon with low resistance, high ductility and optional silver-bearing solder coatings.
The range includes round interconnection wire and flat bus ribbon. High-purity soft TU1 copper minimizes interconnection loss, while multiple solder systems and broad dimensions support different cell and module designs.
Technical specifications: Copper grade: TU1 soft temper. Conductivity: at least 98% IACS. Copper content: at least 99.97%. Other impurities: below 0.002%. Finished round-wire thicknesses: 0.18–0.40 mm. Copper-core thickness: 0.17–0.37 mm. Tin layer: approximately 8±3 μm to 15±4 μm. Finished resistivity: no more than 0.0198 Ω·mm²/m.
Reference price basis: 15 per kg