A highly conductive silver paste formulated for the metallization requirements of different photovoltaic cell technologies.
The paste forms reliable ohmic contact on low-surface-concentration emitters with limited junction damage. It supports fine-line, high-speed printing, stable co-firing with rear aluminum paste and reduced paste consumption.
Technical specifications: Viscosity: 250–350 Pa·s at 25°C using Brookfield HBT, 10 rpm, SC4-14/6R. Solids at 750°C: 89%–91%. Fineness: below 7 μm / below 5 μm. Sheet resistance: below 5 mΩ/sq per 10 μm. Printable line width: 50–80 μm. Shelf life: 6 months.
Reference price basis: 2,200 per kg